☆ Max Layers:28
☆ Max connections:30000
☆ Max PINS:35000
☆ Max BGA per board:30
☆ Min BGA:0.5MM
☆ Min via hole:8mil
☆ Min line width/distance:3mil/4mil
☆ Max high-speed signal:3.125

☆ Data communication series: XDSL, wireless network card, switch, server, optical fiber equipment.
☆ Industry control: medical equipment, image manipulation, test instrument, CMOS chip test board.
☆ Consumer electronics: Security appliance, mobile phone, MP4, digital camera, PDA, GPS.
☆ Home office: Set-top box, Power supply equipment, computer and domestic compliance.
☆ Others: Buried resistance & capacitance board, Flex-rigid board.